Diploma in Poly-Low/PoE Architectures and Thermal Efficiency
Online postgraduate diploma of 800 hours in PoL/PoE architectures and thermal efficiency. 8 modules covering distributed power architectures, Power over Ethernet, high-efficiency PoL converters, losses, heat transfer, thermal simulation and CFD, and system validation, with an assigned technical tutor.
Take the controls.
Run a real engineering trade-off from this field. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Compare distributed power architectures in terms of efficiency and cost.
Design powered devices in line with the IEEE 802.3bt classes.
Size multiphase PoL converters with an appropriate transient response.
Quantify the losses of a complete conversion chain.
Build thermal models with thermal resistances and Foster or Cauer networks.
Simulate the thermal behaviour of equipment using CFD.
Validate a power system both thermally and electrically.
Who it's for
- Power electronics engineers moving into PoL and PoE architectures.
- Power supply designers who need a solid grounding in thermal efficiency.
- Thermal engineers working on power electronics and electronic equipment.
- Network hardware engineers designing PoE switches and powered devices.
- Product validation engineers responsible for power and thermal testing.
- Power system architects in data centres, telecoms and smart lighting.
- Engineering or science graduates looking to enter the data centre sector.
What you'll work with
- IEEE 802.3bt (four-pair Power over Ethernet)
- IEEE 802.3at (PoE Plus)
- IEC 62368-1 (safety of audio/video, information and communication technology equipment)
- JEDEC JESD51-1 (integrated circuit thermal measurement method)
- JEDEC JESD51-14 (transient dual interface test for junction-to-case thermal resistance)
- Regulation (EU) 2019/424 (ecodesign requirements for servers and data storage products)
- PMBus 1.4 (digital power management protocol)
- Ansys Icepak
- Simcenter Flotherm
- PLECS
- LTspice
- Texas Instruments WEBENCH
8 modules
1.1Intermediate bus versus direct conversion1.2Point-of-load (PoL) topologies1.312 V, 48 V and 54 V buses1.4Fixed and regulated conversion ratio1.5Hybrid switched-capacitor converters1.6Power distribution in OCP racks1.7Overall efficiency of the conversion chain1.8Distribution losses and busbar voltage drop1.9Architecture selection according to load profile1.10Case study: powering a server board
2.1Power classes of IEEE 802.3af, at and bt2.2PD detection, classification and signature2.3PSE equipment and power budget management2.4Two-pair and four-pair powering2.5Isolated converters for powered devices2.6Cable losses and cable bundle heating2.7Maintain Power Signature (MPS)2.8Overvoltage and short-circuit protection2.9Interoperability between PSE and PD2.10Lab: commissioning a Class 6 PD
3.1Multiphase synchronous buck converter3.2Current-mode and constant-on-time control3.3Current balancing between phases3.4Integrated power modules and DrMOS3.5PMBus and AVS digital interfaces3.6Transient response and load-line3.7Conduction, switching and driver losses3.8Light-load efficiency and skip modes3.9Selection of output inductors and capacitors3.10Practical: design of a four-phase buck converter
4.1Loss breakdown by component4.2Efficiency measurement with a power analyser4.3Efficiency versus load curves4.4Impact of switching frequency4.5GaN transistors in PoL converters4.6Dynamic voltage and frequency scaling4.780 PLUS programmes and ecodesign requirements4.8Energy balance of the complete chain4.9Multi-objective optimisation of efficiency and size4.10Workshop: efficiency map of a PoL converter
5.1Applied conduction, convection and radiation5.2Junction-case-ambient thermal resistances5.3Foster and Cauer thermal networks5.4Heatsinks, fins and forced airflow5.5Thermal interface materials5.6Thermal vias and heavy copper in PCBs5.7Cold-plate and liquid cooling5.8Thermal derating of components5.9Junction temperature limits and reliability5.10Lab: measuring thermal resistance with thermocouples
6.1Thermal modelling of components and PCBs6.2DELPHI and two-resistor compact models6.3CFD simulation of airflow in a chassis6.4Boundary conditions and thermal meshing6.5Electrothermal co-simulation of losses6.6Transient analysis of load peaks6.7Infrared thermography for validation6.8Sensitivity to altitude and ambient temperature6.9Optimisation of component placement6.10Practical: CFD simulation of a PoL module
7.1Power thermal cycling tests7.2Temperature monitoring and telemetry7.3Thermal protection and controlled shutdown7.4Conducted electromagnetic compatibility tests7.5Loop stability and phase margins7.6Cold and hot start-up tests7.7Service life of electrolytic capacitors7.8Validation documentation and traceability7.9Improvement plans after field failures7.10Case study: validation of a PoE switch
8.1Load specification and power budget8.2Selection of the distribution architecture8.3Design of PoL and PoE stages8.4Estimation of losses and efficiency8.5Thermal model and cooling strategy8.6Thermal simulation of the assembly8.7Validation test plan8.8Analysis of results and improvement proposals8.9Report and presentation8.10Final project: final review with the tutor
How you'll learn
Delivered 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within each intake, so the programme fits around your job.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is Ansys Icepak, Simcenter Flotherm, PLECS, LTspice and Texas Instruments WEBENCH, in free, academic or evaluation versions. Testing is studied through real procedures: converter efficiency measurement with a power analyser, infrared thermography of power boards and PSE–PD interoperability validation. Assessment is continuous by module, plus the final integrating project.
Standards covered: IEEE 802.3bt, IEEE 802.3at, IEC 62368-1, JEDEC JESD51-1, JEDEC JESD51-14, Regulation (EU) 2019/424, PMBus 1.4.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Where this takes you
Requirements
- Prior technical training or professional experience in the sector. No university degree is required.
- Internet connection and a computer capable of running the programme software.
- English sufficient to read technical standards.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme totals 800 hours over 6–8 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.
You work with Ansys Icepak, Simcenter Flotherm, PLECS, LTspice and Texas Instruments WEBENCH, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.
A SEIUM Institute diploma, awarded on passing the continuous assessment and the final project. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.
Yes. Modules passed are recognised in a higher programme in the same area (postgraduate diploma or master's). Ask about the recognition policy when you enrol.
Prior technical training or professional experience in the sector (no university degree required), a computer able to run the programme software, and English sufficient to read technical standards.
Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.
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