Diploma in DFM/DFT and Process Control at EMS
Online postgraduate diploma of 800 hours in DFM/DFT and process control in EMS. 8 modules covering EMS manufacturing, design for manufacturing, design for test, printing and reflow, statistical process control, quality and continuous improvement, and industrialisation, with an assigned technical tutor.
Take the controls.
Run a real engineering trade-off from this field. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Apply DFM rules to improve the manufacturability of electronic boards.
Define DFT strategies using ICT, flying probe and boundary scan.
Optimise solder paste printing and reflow processes.
Calculate capability indices and apply control charts.
Carry out measurement system studies on inspection equipment.
Implement continuous improvement actions using the DMAIC methodology.
Plan the industrialisation of a product in an EMS environment.
Who it's for
- SMT process engineers looking to tighten control of printing and reflow.
- NPI engineers bridging design and production.
- Test engineers defining ICT, flying probe and boundary-scan strategies.
- Quality engineers in EMS companies.
- Industrialisation engineers scaling products from prototype to volume.
- Continuous improvement managers applying Lean and Six Sigma on SMT lines.
- Engineering or science graduates looking to enter electronics manufacturing.
What you'll work with
- IPC-A-610 (acceptability of electronic assemblies)
- J-STD-001 (requirements for soldered electrical and electronic assemblies)
- IPC-7351 (land pattern design for surface-mount components)
- IPC-2581 (manufacturing data exchange format)
- IEEE 1149.1 (boundary scan, JTAG)
- J-STD-020 (moisture/reflow sensitivity classification)
- IPC-CFX-2591 (Connected Factory Exchange)
- IEC 61340-5-1 (protection of electronic devices from electrostatic phenomena)
- Siemens Valor NPI
- Mentor Tessent
- XJTAG
- Minitab
- Aegis FactoryLogix
8 modules
1.1Value chain of EMS services1.2SMT and THT assembly processes1.3Paste printing, placement and reflow1.4Wave and selective soldering1.5Cleaning, conformal coating and potting1.6New product introduction (NPI)1.7Manufacturing documentation and data packages1.8ODB++ and IPC-2581 formats1.9Acceptability requirements for assemblies1.10Case study: a board's journey through an SMT line
2.1Footprint and pad rules according to IPC-73512.2Component spacing and orientation2.3Panels, fiducials and transport edges2.4Design for reflow and wave soldering2.5Copper thieving and layer balancing2.6ENIG, OSP and HASL surface finishes2.7Design for stress-free depanelling2.8BGA, QFN and fine-pitch components2.9Automated DFM review2.10Workshop: DFM review of a real design
3.1Test coverage strategy3.2Test points for ICT and flying probe3.3Boundary scan IEEE 1149.13.4Functional test and fixtures3.5In-system device programming3.6AOI and AXI inspection3.7Fault coverage analysis3.8Design for diagnosis and repair3.9Cost of testing versus escaped defects3.10Practical: DFT plan with boundary scan
4.1Stencil design and area ratio4.2Solder paste rheology4.3Solder paste inspection (SPI)4.4Reflow profiles and process window4.5Nitrogen atmosphere and lead-free soldering4.6Head-in-pillow and tombstoning defects4.7Voids in joints and how to control them4.8Soldering of high-thermal-mass components4.9Profiling with thermocouples4.10Lab: optimising a reflow profile
5.1Process variability and assignable causes5.2X-R and p control charts5.3Cp and Cpk capability indices5.4Measurement system analysis (MSA)5.5R&R studies of inspection equipment5.6Western Electric rules5.7DPMO and sigma level5.8Defect Pareto and stratification5.9Closed-loop SPI and AOI feedback5.10Practical: capability of the printing process
6.1Control plans and process FMEA6.2Lean tools on SMT lines6.3Six Sigma DMAIC methodology6.4Design of experiments applied to the process6.5Batch and component traceability6.6Non-conformance management and 8D6.7Moisture sensitivity level (MSL) control6.8ESD protection on the shop floor6.9Process and product audits6.10Case study: defect reduction with DMAIC
7.1Design transfer to production7.2First article inspection (FAI)7.3MES systems and digital traceability7.4IPC-CFX machine-to-machine communication standard7.5Line OEE indicators7.6Production scheduling and changeovers7.7Supplier and component management7.8Scaling NPI to volume7.9Manufacturing costs and quoting7.10Workshop: industrialisation plan for a board
8.1Analysis of the product and expected volume8.2DFM review and change proposals8.3DFT strategy and estimated coverage8.4Definition of the assembly process8.5Control plan and process FMEA8.6Capability study of a critical stage8.7Quality and monitoring indicators8.8Conclusions and improvement proposal8.9Report and presentation8.10Final project: final review with the tutor
How you'll learn
Delivered 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within each intake, so the programme fits around your job.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is Siemens Valor NPI, Mentor Tessent, XJTAG, Minitab and Aegis FactoryLogix, in free, academic or evaluation versions. Testing is studied through real procedures: DFM reviews of designs before NPI, capability studies on SMT lines and reflow profile optimisation with thermocouples. Assessment is continuous by module, plus the final integrating project.
Standards covered: IPC-A-610, J-STD-001, IPC-7351, IPC-2581, IEEE 1149.1, J-STD-020, IPC-CFX-2591, IEC 61340-5-1.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Where this takes you
Requirements
- Prior technical training or professional experience in the sector. No university degree is required.
- Internet connection and a computer capable of running the programme software.
- English sufficient to read technical standards.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme totals 800 hours over 6–8 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.
You work with Siemens Valor NPI, Mentor Tessent, XJTAG, Minitab and Aegis FactoryLogix, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.
A SEIUM Institute diploma, awarded on passing the continuous assessment and the final project. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.
Yes. Modules passed are recognised in a higher programme in the same area (postgraduate diploma or master's). Ask about the recognition policy when you enrol.
Prior technical training or professional experience in the sector (no university degree required), a computer able to run the programme software, and English sufficient to read technical standards.
Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.
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