Master’s in Heterogeneous Computing Engineering for AD — CPU/GPU/NPUs, Scheduling, Thermal/Power Budgeting
Online master's programme of 1,900 hours in heterogeneous computing engineering for autonomous driving, structured in 12 modules covering CPU/GPU/NPU architectures, automotive SoCs, parallel programming, neural network inference, real-time scheduling, thermal and power budgeting and hardware functional safety under ISO 26262 and AEC-Q100, with an assigned technical tutor.
Take the controls.
Run a real engineering trade-off from this field. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Analyse the computing requirements of an autonomous driving stack.
Compare heterogeneous architectures and automotive SoCs.
Programme accelerators using CUDA and parallel frameworks.
Optimise neural network inference.
Schedule tasks with real-time requirements.
Manage thermal and power budgets.
Develop a complete heterogeneous computing project for autonomous driving.
Who it's for
- Computing platform engineers selecting and integrating SoCs for autonomous driving.
- Inference optimisation engineers deploying neural networks on embedded accelerators.
- Automotive hardware architects defining central compute units.
- Embedded systems engineers working with GPUs, NPUs and DSPs.
- Performance engineers focused on latency, throughput and efficiency.
- Hardware functional safety engineers working with ISO 26262 metrics.
- Engineering or science graduates aiming to enter the automotive sector.
What you'll work with
- ISO 26262 (functional safety of road vehicles)
- AEC-Q100 (stress qualification of automotive integrated circuits)
- ISO 21448 (safety of the intended functionality, SOTIF)
- ISO/SAE 21434 (road vehicle cybersecurity engineering)
- IEC 61508 (functional safety of E/E/PE systems)
- JEDEC JESD51 (thermal measurement of semiconductor packages)
- ISO 16750-4 (climatic loads for automotive electrical equipment)
- MISRA C++:2023 (coding guidelines for safety-critical C++)
- CUDA
- NVIDIA TensorRT
- Apache TVM
- ANSYS Icepak
- Nsight Systems
12 modules · 1900 h
1.1Computing requirements of the AD stack1.2Perception, prediction and planning workloads1.3Operations per second and TOPS1.4End-to-end latency1.5System energy consumption1.6Evolution of computing platforms1.7Centralised computing architectures1.8Hardware cost1.9Silicon trends1.10Case study: computing budget of a robotaxi
2.1Multi-core ARM and x86 CPUs2.2GPUs for inference2.3NPUs and dedicated accelerators2.4DSPs and vision accelerators2.5FPGAs in automotive2.6Lockstep safety islands2.7Memory hierarchy2.8On-chip interconnect2.9Cache coherence2.10Lab: profiling on a heterogeneous SoC
3.1NVIDIA DRIVE Orin and Thor3.2Qualcomm Snapdragon Ride3.3The Mobileye EyeQ family3.4Texas Instruments TDA43.5The Renesas R-Car family3.6Performance comparison3.7Software and SDKs3.8AEC-Q100 component qualification3.9Manufacturers' roadmaps3.10Practical exercise: SoC comparison by use case
4.1The CUDA programming model4.2OpenCL and SYCL4.3Data and task parallelism4.4Kernel optimisation4.5Shared and global memory4.6Host-device transfers4.7DSP programming4.8Optimised libraries cuBLAS and cuDNN4.9Debugging parallel code4.10Workshop: CUDA pre-processing kernel
5.1Model compilation5.2TensorRT and optimisations5.3INT8 and FP8 quantisation5.4Pruning and distillation5.5Layer fusion5.6Partitioning across accelerators5.7Batch size and latency5.8Model compilers such as TVM5.9Accuracy validation5.10Lab: deployment with TensorRT
6.1Task scheduling in heterogeneous systems6.2DAG task graphs6.3Priorities and preemption6.4GPU scheduling6.5Response-time analysis6.6WCET on heterogeneous hardware6.7Memory interference6.8Temporal partitioning of resources6.9Analysis tools6.10Practical exercise: analysis of a processing chain
7.1Power dissipation in SoCs7.2Thermal throttling and its effects7.3Air and liquid cooling7.4Heatsink design7.5Thermal modelling of the unit7.6Extreme automotive environments7.7Temperature monitoring7.8Dynamic thermal management7.9Thermal validation in a climatic chamber7.10Workshop: thermal simulation with Icepak
8.1System power budget8.2Dynamic voltage and frequency scaling8.3Low-power states8.4Workload-based power management8.5Impact on vehicle range8.6Power supplies8.7Energy efficiency of inference8.8Optimising the power-performance trade-off8.9Power consumption monitoring8.10Lab: performance-power curve
9.1ISO 26262 parts 5 and 119.2SPFM and LFM metrics9.3Lockstep and redundancy9.4ECC and memory protection9.5SoC safety monitors9.6Hardware FMEDA9.7Radiation-induced soft errors9.8Freedom from interference9.9Safety manuals9.10Case study: FMEDA of an SoC
10.1Hypervisors on SoCs10.2GPU partitioning10.3Memory isolation10.4Accelerator allocation10.5Mixed criticality on a single SoC10.6Containers on virtual machines10.7Resource management10.8Virtualisation performance10.9Partitioning security10.10Practical exercise: partitioning with a hypervisor
11.1MLPerf Automotive benchmarks11.2Performance metrics11.3Latency testing11.4Thermal testing under sustained load11.5Platform comparison11.6Evaluation methodology11.7Profiling tools11.8Performance reports11.9Decision-making11.10Workshop: benchmark of an AD pipeline
12.1Definition of the workload12.2Platform selection12.3Mapping tasks to accelerators12.4Inference optimisation12.5Scheduling and real time12.6Thermal and power management12.7System evaluation12.8Conclusions and future work12.9Thesis report12.10Master's Thesis: defence before a panel
How you'll learn
Training is 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within the intake, so the programme can be combined with work.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is CUDA, NVIDIA TensorRT, Apache TVM, ANSYS Icepak and Nsight Systems, in free, academic or evaluation versions. Exercises are based on real procedures for profiling inference workloads, thermal testing of compute units and benchmarking driving platforms. Assessment is continuous by module, plus the final Master's Thesis.
Standards covered: ISO 26262, AEC-Q100, ISO 21448, ISO/SAE 21434, IEC 61508, JEDEC JESD51, ISO 16750-4, MISRA C++:2023.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Where this takes you
Requirements
- A university degree in engineering, science or architecture, or equivalent demonstrable professional experience.
- An internet connection and a computer capable of running the programme's software.
- English sufficient to read technical standards.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme totals 1,900 hours over 12–14 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.
You work with CUDA, NVIDIA TensorRT, Apache TVM, ANSYS Icepak and Nsight Systems, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.
A SEIUM Institute diploma, awarded on passing the continuous assessment and the Master's Thesis. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.
Yes. Modules passed in a course or postgraduate diploma in the same area are recognised in the higher programme. Ask about the recognition policy when you enrol.
A university degree in engineering, science or architecture (or equivalent professional experience), a computer able to run the programme's software and English sufficient to read technical standards.
Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.
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