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Master'sElectronics, Embedded Systems & Telecom Applications open

Master’s in Resonant and High-Frequency Converters

Online master's programme of 1,900 hours in resonant and high-frequency converters (LLC, ZVS/ZCS and advanced magnetics). 12 modules covering resonant tanks, LLC and advanced resonant topologies, GaN and SiC wide-bandgap devices, high-frequency magnetics, control, layout and parasitics, EMC and wireless power transfer, applied to IEC 62368-1, CISPR 32 and IEC 61000-3-2 with an assigned technical tutor.

Duration12–14 months
ModeOnline
LanguageEnglish
Start datesSet by the faculty
AwardSEIUM Institute diploma
Enrol now View syllabus Ask an advisor

Master’s in Resonant and High-Frequency Converters — studying from Singapore

Singapore is one of Asia's leading electronics manufacturing centres, with semiconductor fabrication, back-end assembly and test, and precision electronics concentrated in areas such as Tampines and Jurong. The sector also includes embedded systems for industrial and automotive use and a strong telecommunications base led by the Infocomm Media Development Authority. Major employers include global semiconductor firms and electronics manufacturers. Engineers work on hardware design, firmware, communications systems and test engineering.

Fees for Singapore: S$11,300 (Singapore dollar), with instalments and employer sponsorship available.

Relevant bodies in Singapore

  • Infocomm Media Development Authority (IMDA)
  • Singapore Semiconductor Industry Association
  • Institute of Electrical and Electronics Engineers (IEEE) Singapore Section
  • Enterprise Singapore

Typical roles

  • Embedded Systems Engineer
  • Electronics Design Engineer
  • Telecommunications Engineer
  • Test Engineer

Questions from Singapore

How are electronics and telecom engineers recognised in Singapore, and does SEIUM count?

Telecom and electronics engineering is regulated by the Infocomm Media Development Authority (IMDA), and engineers may register with the Professional Engineers Board (PEB). SEIUM's qualifications are private, not state degrees, and not accredited by any national body. Whether they are recognised is decided by employers or the relevant body, so confirm this before enrolling.

Which Singapore employers hire embedded systems and telecom engineers?

Singapore has demand from telecom operators, semiconductor and electronics manufacturers, defence and aerospace firms, and industrial automation companies. Employers generally assess hands-on skills in firmware, hardware design and testing. Your final project can evidence embedded or telecom competence, but its value is for each employer to judge.

Can I follow this from Singapore while working, and does it need a visa?

Yes, the programmes are 100% online and taught in English, so no student visa is needed to study from home in Singapore. Expect a heavy workload: 1,900 hours for a master's, 800 for a postgraduate diploma and 300 for a specialist course. Fees can be paid in instalments, and employer sponsorship is possible.

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Learning outcomes

What you will be able to do

01

Analyse the benefits and challenges of high-frequency operation.

02

Design resonant tanks and LLC converters.

03

Apply advanced and bidirectional resonant topologies.

04

Use GaN and SiC semiconductors reliably.

05

Design high-frequency magnetics.

06

Control resonant converters and manage EMC.

07

Develop wireless power transfer systems.

Profile

Who it's for

  • Power electronics engineers moving into resonant and high-frequency conversion.
  • Power supply engineers aiming to raise efficiency and power density.
  • Magnetics designers working on planar transformers and high-frequency components.
  • GaN applications engineers.
  • Wireless charging engineers.
  • Power validation engineers.
  • Engineering or science graduates looking to enter consumer electronics.
Standards & tools

What you'll work with

  • IEC 62368-1 (safety of audio/video, information and communication technology equipment)
  • CISPR 32 (electromagnetic emissions of multimedia equipment)
  • IEC 61000-3-2 (limits for harmonic current emissions)
  • SAE J2954 (wireless power transfer for light-duty electric vehicles)
  • Qi – Wireless Power Consortium (wireless charging standard)
  • JEP180 – JEDEC (guideline for switching reliability of GaN power devices)
  • IEC 60747-9 (semiconductor devices – IGBTs)
  • PLECS
  • LTspice
  • Ansys Maxwell
  • Frenetic
  • MATLAB Simulink
Syllabus

12 modules

  1. 1.1Why increase the frequency
  2. 1.2Power density and size
  3. 1.3Switching losses
  4. 1.4Hard versus soft switching
  5. 1.5Wide-bandgap semiconductors
  6. 1.6Limits of magnetics
  7. 1.7High-frequency parasitics
  8. 1.8Typical applications
  9. 1.9State of the art
  10. 1.10Case study: comparison of a converter at 100 kHz and at 1 MHz
  1. 2.1Series and parallel resonant circuits
  2. 2.2Quality factor
  3. 2.3First harmonic approximation
  4. 2.4Tank gain
  5. 2.5LC, LLC and LCC topologies
  6. 2.6Component currents and voltages
  7. 2.7Design of resonant capacitors
  8. 2.8Sensitivity to tolerances
  9. 2.9Tank simulation
  10. 2.10Lab: design of an LLC tank
  1. 3.1Operating principle
  2. 3.2Operating regions
  3. 3.3Primary-side ZVS switching
  4. 3.4Synchronous rectification
  5. 3.5Design for a voltage range
  6. 3.6Frequency modulation
  7. 3.7Burst mode at light load
  8. 3.8Soft start
  9. 3.9Protections
  10. 3.10Practical exercise: 1 kW LLC for servers
  1. 4.1Bidirectional CLLC
  2. 4.2Dual Active Bridge
  3. 4.3Class E converters
  4. 4.4Class Φ2 converters
  5. 4.5Phase-shifted full bridge
  6. 4.6Quasi-resonant converters
  7. 4.7Resonant multilevel converters
  8. 4.8Switched-capacitor converters
  9. 4.9Topology selection
  10. 4.10Lab: simulation of a CLLC
  1. 5.1GaN HEMT transistors
  2. 5.2SiC MOSFETs
  3. 5.3Charge losses and Coss
  4. 5.4Low-inductance packages
  5. 5.5Gate drivers
  6. 5.6Gate protection
  7. 5.7Thermal behaviour
  8. 5.8GaN reliability
  9. 5.9Device comparison
  10. 5.10Practical exercise: double-pulse testing with GaN
  1. 6.1Ferrite materials
  2. 6.2Core losses (Steinmetz)
  3. 6.3Skin and proximity effects
  4. 6.4Litz wire
  5. 6.5Planar transformers
  6. 6.6Integrated leakage inductance
  7. 6.7Parasitic capacitances
  8. 6.8Thermal design
  9. 6.9FEM simulation
  10. 6.10Lab: design of a planar transformer
  1. 7.1Frequency control
  2. 7.2Phase-shift control
  3. 7.3Hybrid control
  4. 7.4Small-signal modelling
  5. 7.5Voltage loop
  6. 7.6Digital control
  7. 7.7Dedicated controllers
  8. 7.8Transient response
  9. 7.9Stability
  10. 7.10Practical exercise: digital control of an LLC
  1. 8.1Power loop
  2. 8.2Parasitic inductances
  3. 8.3Layout for GaN
  4. 8.4High-frequency decoupling
  5. 8.5Voltage and current measurement
  6. 8.6Probes and measurement techniques
  7. 8.7Ringing and its damping
  8. 8.8Parasitic simulation
  9. 8.9Layout rules
  10. 8.10Lab: power loop measurement
  1. 9.1Common-mode noise
  2. 9.2EMI filters
  3. 9.3Inter-winding capacitance
  4. 9.4Shielding
  5. 9.5Spread spectrum
  6. 9.6CISPR 32 and CISPR 11 standards
  7. 9.7Pre-compliance measurements
  8. 9.8Design for EMC
  9. 9.9Practical solutions
  10. 9.10Case study: correcting an emissions problem
  1. 10.1Inductive coupling
  2. 10.2Resonant compensation
  3. 10.3The Qi standard
  4. 10.4Wireless vehicle charging (SAE J2954)
  5. 10.5Alignment and efficiency
  6. 10.6Foreign object detection
  7. 10.7Field exposure
  8. 10.8Power control
  9. 10.9Industrial applications
  10. 10.10Practical exercise: resonant inductive link
  1. 11.180 PLUS Titanium server power supplies
  2. 11.2GaN USB-C chargers
  3. 11.3On-board vehicle chargers
  4. 11.4Converters for aerospace
  5. 11.5Medical power supplies
  6. 11.6LED lighting
  7. 11.7Induction heating
  8. 11.8Power supplies for RF
  9. 11.9Trends
  10. 11.10Workshop: specification of a 140 W GaN charger
  1. 12.1Specification
  2. 12.2Topology selection
  3. 12.3Resonant tank design
  4. 12.4Semiconductor selection
  5. 12.5Magnetics design
  6. 12.6Control
  7. 12.7Prototype and measurements
  8. 12.8Efficiency analysis
  9. 12.9Master's Thesis report
  10. 12.10Master's Thesis: defence before a panel
Methodology, software & labs

How you'll learn

Training is 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within each intake, so it fits around your job.

Each module combines theory, guided reading of the original standard and applied exercises. The working software is PLECS, LTspice, Ansys Maxwell, Frenetic and MATLAB Simulink, in free, academic or evaluation versions. Testing is studied through real procedures for double-pulse tests, bench efficiency measurements and EMC pre-compliance tests. Assessment is continuous by module, plus the final Master's Thesis.

Standards covered: IEC 62368-1, CISPR 32, IEC 61000-3-2, SAE J2954, Qi (Wireless Power Consortium), JEP180 (JEDEC), IEC 60747-9.

Assigned technical tutor:every module ends with a deliverable that your tutor marks individually.
Standards-based learning:guided reading of IEC 62368-1, CISPR 32 and IEC 61000-3-2 applied to real cases, not as a theoretical annex.
Industry software:PLECS, LTspice, Ansys Maxwell, Frenetic and MATLAB Simulink, in free, academic or evaluation versions.
Master's Thesis with defence:Full design of a resonant converter, from specification and topology selection to prototype, measurements and efficiency analysis, defended before a panel.
Flexible format:100% online, no fixed timetables, compatible with full-time work.
Capstone project

Build it end to end

Your final project follows the real engineering workflow, step by step, reviewed by your tutor.

Resonant tank design
Design an LLC resonant tank and check its gain and sensitivity to tolerances.
1 kW LLC for servers
Develop a 1 kW LLC converter with ZVS and synchronous rectification.
GaN double-pulse testing
Characterise a GaN device with a double-pulse test and compare its losses.
Planar transformer and EMC
Design a planar transformer and correct an emissions problem against CISPR 32.
Master's Thesis
Full design of a resonant converter, from specification to prototype and efficiency analysis, defended before a panel.
Career opportunities

Where this takes you

Power electronics engineerPower supply engineerMagnetics designerGaN applications engineerWireless charging engineerPower validation engineer
Admissions & scholarships

Requirements

  • University degree in engineering, science or architecture, or equivalent demonstrable professional experience.
  • Internet connection and a computer able to run the programme software.
  • English sufficient to read technical standards.

Ready to start?

Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.

Apply now Scholarships
FAQ

Frequently asked questions

The programme totals 1,900 hours over 12–14 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.

You work with PLECS, LTspice, Ansys Maxwell, Frenetic and MATLAB Simulink, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.

A SEIUM Institute diploma, awarded on passing the continuous assessment and the Master's Thesis. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.

Yes. Modules passed in a course or postgraduate diploma in the same area are recognised in the higher programme. Ask about the recognition policy when you enrol.

A degree in engineering, science or architecture (or equivalent professional experience), a computer able to run the software, and English sufficient to read technical standards.

Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.

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