Postgraduate DiplomaElectronics, Embedded Systems & Telecom Applications open

Diploma in Timing Closure, Floorplanning and DFT

Online postgraduate diploma of 800 hours in Timing Closure, Floorplanning and DFT: 8 modules covering static timing analysis, timing closure techniques, chip and FPGA floorplanning, physical implementation, design for test, BIST and boundary scan, and sign-off for production, with an assigned technical tutor.

Duration6–8 months
ModeOnline
LanguageEnglish
Start datesSet by the faculty
AwardSEIUM Institute diploma
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Learning outcomes

What you will be able to do

01

Analyse timing paths with STA across multiple corners and modes.

02

Apply timing closure techniques in ASIC and FPGA designs.

03

Plan the floorplan and power network of a chip.

04

Run a physical implementation flow through to sign-off.

05

Insert scan structures and generate patterns with ATPG.

06

Integrate BIST, boundary scan and IJTAG networks.

07

Prepare a design for tape-out and production test.

Profile

Who it's for

  • Physical implementation engineers aiming to master the full back-end flow.
  • STA engineers responsible for timing constraints and sign-off.
  • DFT engineers working on scan, ATPG and BIST.
  • ASIC back-end engineers preparing designs for tape-out.
  • Semiconductor test engineers who need to understand DFT structures and yield.
  • FPGA engineers facing demanding timing closure and floorplanning challenges.
  • Engineering or science graduates looking to enter the semiconductor industry.
Standards & tools

What you'll work with

  • IEEE 1149.1-2013 – JTAG (boundary-scan test access port)
  • IEEE 1500-2005 (embedded core test wrappers)
  • IEEE 1687-2014 – IJTAG (access to embedded instruments)
  • IEEE 1801-2018 – UPF (low-power design intent)
  • IEEE 1149.6-2015 (boundary scan for AC-coupled and differential signals)
  • ISO 26262-11:2018 (functional safety guidelines for semiconductors)
  • Synopsys PrimeTime
  • Cadence Innovus
  • Siemens Tessent
  • AMD Vivado
  • OpenROAD
Syllabus

8 modules

  1. 1.1Timing paths: startpoints and endpoints
  2. 1.2Setup, hold and slack
  3. 1.3NLDM and CCS delay models
  4. 1.4PVT corners and multi-mode analysis
  5. 1.5On-chip variation: OCV, AOCV and POCV
  6. 1.6SDC constraints: clocks and exceptions
  7. 1.7False paths and multicycle paths
  8. 1.8Interpreting timing reports
  9. 1.9Clock skew, latency and uncertainty
  10. 1.10Lab: SDC constraints for a multi-clock design
  1. 2.1Timing-driven synthesis
  2. 2.2Retiming and register duplication
  3. 2.3Logic restructuring and pipelining
  4. 2.4Cell sizing and Vt swapping
  5. 2.5Buffer insertion and hold fixing
  6. 2.6Late-stage timing ECOs
  7. 2.7Sign-off with parasitic extraction
  8. 2.8Crosstalk and signal integrity analysis
  9. 2.9FPGA closure: directives and pblocks
  10. 2.10Practical: timing closure of a critical path
  1. 3.1Floorplan objectives and inputs
  2. 3.2Die sizing and utilisation
  3. 3.3Placement of macros and memories
  4. 3.4Power rings and meshes
  5. 3.5Hierarchical partitioning into blocks
  6. 3.6Pins, I/O and bump planning
  7. 3.7Placement regions and constraints
  8. 3.8Early congestion analysis
  9. 3.9FPGA floorplanning with pblocks
  10. 3.10Workshop: floorplan of an SoC with SRAM memories
  1. 4.1Global and detailed placement
  2. 4.2Clock tree synthesis (CTS)
  3. 4.3Global and detailed routing
  4. 4.4Physical verification with DRC and LVS
  5. 4.5IR drop and electromigration analysis
  6. 4.6Power optimisation and multi-Vt
  7. 4.7Low-power design with UPF
  8. 4.8Filler, tap and endcap cells
  9. 4.9Open-source flow with OpenROAD
  10. 4.10Lab: RTL-to-GDS flow with OpenROAD
  1. 5.1Fault models: stuck-at and transition
  2. 5.2Controllability and observability
  3. 5.3Scan chain insertion
  4. 5.4Scan compression and EDT
  5. 5.5DFT rules and typical violations
  6. 5.6ATPG and fault coverage
  7. 5.7At-speed patterns and test clocks
  8. 5.8Impact of DFT on area and timing
  9. 5.9Quality metrics and DPPM
  10. 5.10Practical: scan insertion and ATPG
  1. 6.1Memory BIST and March algorithms
  2. 6.2Logic BIST and LFSR generators
  3. 6.3Boundary scan with IEEE 1149.1
  4. 6.4Core wrappers according to IEEE 1500
  5. 6.5IJTAG networks with IEEE 1687
  6. 6.6Memory repair and fuses
  7. 6.7In-system and in-field test
  8. 6.8ISO 26262 requirements for test
  9. 6.9Diagnosis and wafer yield analysis
  10. 6.10Lab: MBIST on an embedded memory
  1. 7.1Multi-corner, multi-mode sign-off
  2. 7.2Final physical verification
  3. 7.3Logic equivalence after ECO
  4. 7.4Timing-annotated pattern simulation
  5. 7.5Test programs on ATE
  6. 7.6Yield learning and failure diagnosis
  7. 7.7Silicon testing in the laboratory
  8. 7.8Test cost and optimisation
  9. 7.9Tape-out checklist
  10. 7.10Case study: tape-out review of a block
  1. 8.1Design specification and constraints
  2. 8.2Floorplan and power network
  3. 8.3Implementation and timing closure
  4. 8.4DFT insertion and ATPG
  5. 8.5Coverage and area analysis
  6. 8.6Sign-off verification
  7. 8.7Report of the results obtained
  8. 8.8Lessons learnt from the flow
  9. 8.9Report and presentation
  10. 8.10Final project: final review with your tutor
Methodology, software & labs

How you'll learn

The programme is delivered 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within the intake, so you can combine it with your job.

Each module combines theory, guided reading of the original standard and applied exercises. The working software is Synopsys PrimeTime, Cadence Innovus, Siemens Tessent, AMD Vivado and OpenROAD, in free, academic or evaluation versions. Testing is studied through real procedures: multi-corner timing analysis, scan insertion and ATPG pattern generation, and timing closure on FPGA. Assessment is continuous, module by module, plus the final project.

Standards covered: IEEE 1149.1-2013 (JTAG), IEEE 1500-2005, IEEE 1687-2014 (IJTAG), IEEE 1801-2018 (UPF), IEEE 1149.6-2015 and ISO 26262-11:2018.

Assigned technical tutor:every module ends with a deliverable that your tutor marks individually.
Standards-based learning:guided reading of IEEE 1149.1 (JTAG), IEEE 1500 and IEEE 1687 (IJTAG) applied to real cases, not as a theoretical annex.
Industry software:Synopsys PrimeTime, Cadence Innovus, Siemens Tessent, AMD Vivado and OpenROAD, in free, academic or evaluation versions.
Final project:a design taken from constraints through floorplan, implementation, timing closure and DFT insertion to sign-off, reviewed by your tutor.
Flexible format:100% online, no fixed timetables, compatible with full-time work.
Capstone project

Build it end to end

Your final project follows the real engineering workflow, step by step, reviewed by your tutor.

Specification and constraints
Define the design specification and write its timing constraints.
Floorplan and power network
Plan the floorplan, macro placement and power distribution network.
Implementation and timing closure
Implement the design and close timing across corners and modes.
DFT insertion and ATPG
Insert scan structures, generate ATPG patterns and analyse coverage.
Final project
Complete sign-off verification and report results and lessons learnt, reviewed by your tutor.
Career opportunities

Where this takes you

Physical implementation engineerSTA engineerDFT engineerASIC back-end engineerSemiconductor test engineerFPGA engineer
Admissions & scholarships

Requirements

  • Prior technical training or professional experience in the sector. No university degree is required.
  • An internet connection and a computer capable of running the programme software.
  • English sufficient to read technical standards.

Ready to start?

Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.

FAQ

Frequently asked questions

The programme totals 800 hours over 6–8 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.

You work with Synopsys PrimeTime, Cadence Innovus, Siemens Tessent, AMD Vivado and OpenROAD, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.

A SEIUM Institute diploma, awarded on passing the continuous assessment and the final project. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.

Yes. Modules passed are recognised in a higher programme in the same area (postgraduate diploma or master's). Ask about the recognition policy when you enrol.

Prior technical training or professional experience in the sector (no university degree required), a computer able to run the programme software and English sufficient to read technical standards.

Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.

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